While SiP Layout Option is – and continues to be – one of the most complete solutions for package design, the Virtuoso RF Solution gives access to a constantly increasing set of package layout authoring capabilities inside the Virtuoso Layout Suite. Having both IC and package inside the same design platform enables Virtuoso users to do package layout in their preferred design environment. An innovative co-design environment reduces the design cycle and eliminates error-prone manual steps to align the IC with the package. Full interoperability with SiP allows designers to switch between Virtuoso RF Solution and SiP Layout Option, and to work in an environment of their choice, the one they feel most comfortable. To allow seamless working on same design using different tools, it is very beneficial to have most of the functionalities available in both tools. Cadence is working hard on a smooth and user-friendly flow, and we are almost there.(read more)![]()
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