I’m back again, it has been a while, but guess what… I have a lot of goodies to share with you. Since last time I posted a blog, our Virtuoso System Design solutions have gone through a lot of enhancements, and more automations have been accomplished. You may already have read our blog, Virtuoso Meets Maxwell: Getting Your Existing SiP File Into Virtuoso RF Solution, which covers how you can bring your existing SiP design into the Virtuoso platform to create package technology and design libraries. The libraries include a schematic and a layout that represent your SiP layout in OpenAccess. You can bind your die footprint to the IC design to use the Edit-in-Concert capabilities and cross-fabric electromagnetic analysis between IC and package designs.
In this blog we assume that you have already read through the Virtuoso Meets Maxwell: Getting Your Existing SiP File Into Virtuoso RF Solution and the Virtuoso Meets Maxwell: Export the Die? What Am I Exporting? To Where? blogs. Consequently, you know how the package libraries are created in Virtuoso and the requirements for exporting a die footprint.(read more)![]()
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