The shift to heterogeneous integration of module designs implies a transition from PCB-styled flows and methodologies towards IC-styled flows. Cross-fabric design and verification methodologies for multi-die packages have become indispensable parts of any advanced module design flow. Cadence is uniquely positioned to lead and spearhead this transition. To address the challenges of a rapidly increasing market driven by 5G, Automotive, and IoT applications Cadence has augmented the widely used Virtuoso Design Environment with a MultiTech Framework.(read more)![]()
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