Virtuoso Meets Maxwell: Thinking Outside the Chip--Advantages of Interoperability Between Best-In-Class IC and IC Packaging Design and Verification Tools

Many of today’s analog, RF, and mixed-signal designs require the integration of multiple ICs across varying substrate technologies to achieve required performance goals. The integration of heterogeneous devices allows designers to achieve results that can’t easily be duplicated using a monolithic IC (SoC) design approach. At the same time, heterogeneous integration introduces a whole new set of challenges for today’s designers.(read more)