Heterogeneous integration of components using different process technologies can appear to be magic! It mitigates the high cost of homogeneous system-on-chip (SOC) integration by allowing designers to combine proven designs, which use older nodes, on substrates by using newer process technologies. Traditional outsourced assembly and test (OSAT) vendors and IC vendors are competing to provide integration methodologies, such as Fan-Out Wafer-Level packaging, which can be used to build smaller and more efficient systems. (read more)![]()
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